By Banqiu Wu,Ajay Kumar,Sesh Ramaswami
The most modern advances in 3-dimensional built-in circuit stacking technology
With a spotlight on business purposes, 3D IC Stacking Technology bargains accomplished insurance of layout, attempt, and fabrication processing tools for three-d equipment integration. every one bankruptcy during this authoritative advisor is written by means of specialists and information a separate fabrication step. destiny purposes and state of the art layout capability also are mentioned. this is often an important source for semiconductor engineers and transportable equipment designers.
3D IC Stacking Technology covers:
- High density via silicon stacking (TSS) technology
- Practical layout atmosphere for heterogeneous 3D IC products
- Design automation and TCAD instrument options for via silicon through (TSV)-based 3D IC stack
- Process integration for TSV manufacturing
- High-aspect-ratio silicon etch for TSV
- Dielectric deposition for TSV
- Barrier and seed deposition
- Copper electrodeposition for TSV
- Chemical mechanical sharpening for TSV applications
- Temporary and everlasting bonding
- Assembly and try out points of TSV technology
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3D IC Stacking Technology by Banqiu Wu,Ajay Kumar,Sesh Ramaswami